Student Veterans of America Jobs

Welcome to SVA’s jobs portal, your one-stop shop for finding the most up to date source of employment opportunities. We have partnered with the National Labor Exchange to provide you this information. You may be looking for part-time employment to supplement your income while you are in school. You might be looking for an internship to add experience to your resume. And you may be completing your training ready to start a new career. This site has all of those types of jobs.

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Job Information

Intel Memory Sourcing Engineering Manager in Phoenix, Arizona

Job Description

The GSCO organization focuses on developing and executing sourcing strategies which provide Intel with a competitive advantage by maintaining appropriate tension and balance between cost, quality, availability, technology, and sustainability.

The Memory Strategic Sourcing (MSS) team within GSCO is responsible for managing the supply chain enablement for DRAM, SSD/NAND and various in-package custom memory solutions for both our Intel assembly package roadmaps along with those of our business unit partners leveraging external contract manufacturers to support client and data center market segments. This team manages a broad supplier ecosystem including all of the major Tier 1 memory providers.

As the Memory Sourcing Engineering Manager you will be responsible for but not limited to:

  • Set priorities for the team, get results across boundaries, ensure an inclusive work environment, develop employees, and manage performance.

  • Partners across multiple Business Unit partner teams to align on deliverables and priorities.

  • Closely manages supplier relationships from an Engineering perspective across the Memory Industry ecosystem.

  • Plans, provides resources, and directs activities in engineering functions to meet schedules, standards, and costs.

  • Cultivates and reinforces appropriate group values, norms, and behaviors.

  • Identifies and analyzes problems, plans, tasks, and solutions.

  • Provides guidance on employee development, performance, and productivity issues.

  • Plans and schedules daily tasks, uses judgement on a variety of problems requiring deviation from standard practices.

The ideal candidate should exhibit the following behavioral traits:

  • Skills to drive results across organizational boundaries, lead and work with teams spread across

  • different geographies/business units.

  • Strong problem-solving skills.

  • Strong written and verbal communication and presentation skills.

Technical understanding of memory hierarchies and design constraints around architecting embedded platforms based on microprocessors, FPGAs, memories and storage products.

Strong command over and familiarity with Intel product roadmap and ability to map and drive market trends to Intel's needs.

Ability to apply structured problem solving and system thinking to drive and solve high-impact and at-scale engineering problems within Intel's memory engineering ecosystem.

Supplier management experience.


You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Candidate must possess a Master's Degree or Ph.D. in Mechanical Engineering, Materials Science, Physics, Electrical, Computer Engineering, or related degree with a focus on microelectronics, electronic package, or semiconductors.

15+ years of experience working in Semiconductor Packaging within a technology development or new product or microprocessor platform development environment.

7+ years of experience in leading and managing global teams.

Preferred qualifications:

Experience working on new product introductions, in assembly, test or validation.

Knowledge in:

· Budget planning.

· Supply chain business processes.

· NPI development process.

· Leading multi-cultural globally distributed teams.

· Project management.

· Assembly, test manufacturing processes and platform engineering.

· Understanding of reliability failure modes in semiconductor processing and electronic packaging, inclusive of die to package interaction failures.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Other Locations

South Korea, Seoul;US, California, Folsom;US, California, Santa Clara;US, Oregon, Hillsboro

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter....