Student Veterans of America Jobs

Analyze

and develop

back-end processes for

manufacturing

semiconductor packaging glass substrat

es, focusing on deposition, etching, patterning, and other material processing technique;

I

dentify areas for improvement

and i

mplement optimization strategies to enhance efficiency, reduce costs, and improve overall product quality

;

Design

experiments, analyze results, and iterate back-end processes

for semiconductor packaging glass substrate manufacturing

to achieve optimal performance, yield, and reliability

;

Evaluate and select materials suitable for semiconductor packaging glass substrates based on properties such as thermal conductivity, coefficient of thermal expansion

,

electrical insulation, and mechanical strength

;

Address technical issues and challenges related to semiconductor packaging glass substrate

back-end

processing

;

Utilize analytical skills and engineering principles to diagnose root causes, propose solutions, and implement corrective actions to minimize production downtime and optimize yield

;

Continuously improve back-end processes to increase yield, reduce defects, and lower production costs

;

Evaluate emerging embedding technologies and methodologies in the field of semiconductor packaging glass substrate

s and c

onduct thorough assessments of competing approaches

;

Stay

updated with the latest advancements in the field, exploring novel techniques, and collaborating with

the

cross-functional team to innovate in glass substrate processing

and develop next-generation semiconductor packaging glass substrates;

Provide training to

local

engineers involved in semiconductor packaging glass substrate

back-end

processing

;

Ensure compliance with relevant industry regulations, safety standards, and environmental guidelines in all aspects of semiconductor packaging glass substrate processin

g; and

Maintain and generate detailed documentation of process specifications, operating procedures, experimental results, process performance, yield trends, and improvement initiatives[]{style="background:whi

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