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Micron Technology, Inc. SR NAND Process Development Engineer – Wafer Bonding in Boise, Idaho

Our vision is to transform how the world uses information to enrich life for all .

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Process and Equipment Development Engineer in the NAND wafer bonding R&D team, you will be primarily responsible for developing and optimizing wafer bond processes (bond, trim, grind, and others) and equipment to improve product quality and reliability for the next generation of Micron's memory parts. You will take ideas from conception, through process development, all the way to implementation in our production facilities. You will also be required to identify, diagnose, and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment, and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications, and managing, auditing, and liaising with material suppliers to achieve quality, cost, and risk management objectives.

At Micron, we tackle challenging tactical and technical problems to meet the demands of our fast-paced and dynamic development environment. You will be working in a highly collaborative atmosphere, interacting with various groups such as process integration, electrical failure analysis, yield enhancement, manufacturing, and equipment vendors, to ensure robust processes that meet the detailed physical and electrical requirements for Micron products. You will grow into an expert engineer, driving wafer bonding technology roadmaps, which have a direct influence on Micron’s global leadership in semiconductor manufacturing.

Responsibilities include, but not limited to:

  • Developing dielectric and hybrid bonding processes and equipment to meet the physical and electrical requirements of Micron’s products.

  • Optimizing processes and equipment to reduce cost, process variability, and improve process capability.

  • Collaborating with process integration and other process development teams to develop innovative new solutions.

  • Conducting root cause and failure mode analysis to understand the limitations of current hardware and drive Bond development projects with OEMs vendors for solutions.

  • Develop hardware and process roadmaps for 5+ years in the area of wafer bonding (including bonding, trim, grinding).

  • Performing fundamental research to drive innovative solutions for next-generation products.

  • Maintaining a technology development pilot manufacturing line.

  • Support process and equipment transfer to production facilities (some international travel may be required).

Minimum Qualifications:

  • Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis

  • Strong analytical and creative problem-solving skills.

  • Ability to use extensive technical knowledge to guide strategic directions.

  • Ability to resolve complex issues through root-cause or model-based problem solving.

  • Proficiency in statistics, preferably in statistical process control.

  • Ability to work independently, with minimal direction, and a focus on meeting commitments.

  • Ability to multi-task and manage numerous projects simultaneously.

  • Hands on experience with wafer bonding tools and overlay systems.

Education and Experience.

  • M.S./Ph. D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics, or other related technical fields.

  • 3 to 5 years of semiconductor process engineering experience in wafer bonding and packaging related processes preferably in 300mm wafer fab.

  • Experience in dielectrics/hybrid bond process development with fundamental understanding of bond process and equipment interactions.

  • Experience in wafer bonding process development and understanding of bonding related inline/electrical/probe failure.

  • Knowledge of semiconductor processing, solid-state device physics desirable.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your right to work click here. (http://www.justice.gov/crt/worker-information)

To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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